Low-loss board for micrometer and millimeter waveform ranges.
Because of the low water absorption ratio, absorption of chemicals, etc. can be minimized.
Low linear thermal expansion board suitable for multi-layer boards

Fluorocarbon polymers
Glass fiber cloth
Inorganic filler
Copper foil

For automobiles: collision prevention radar, peripheral detection radar
For wireless communication infrastructure: antenna, 5G small cell, backhaul wireless communication
For cable communication infrastructure: high-speed photoelectric transducer
Millimeter and micrometer waveform applications

Relative permittivity: 3.00
Dissipation factor: 0.0012
Coefficient of linear expansion of thickness: 39 ppm/°C
Note: measured values for a nominal thickness of 0.127

Fluororesin substrates for high-frequency